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Lantronix Introduces New Open-Q Family of SIP Modules That Deliver High-Performance for Mass Market Robotics and IoT Projects
Now available, the new Open-Q chipset modules use Qualcomm System-on-Chip products for a comprehensive, cost-effective solution for everyday robotics and IoT
About this update from Lantronix, Inc.
[{"type":"text","content":"Now available, the new Open-Q chipset modules use Qualcomm System-on-Chip products for a comprehensive, cost-effective solution for everyday robotics and IoT productsIRVINE, Calif., March 14, 2023 (GLOBE NEWSWIRE) -- Lantronix Inc. (NASDAQ: LTRX), a global provider of secure turnkey solutions for the Industrial Internet of Things (IoT) and the Intelligent IT market, today announced the expansion of its Open-Q™ family with its new entry-level Open-Q 2210RB and mid-tier Open-Q 4210RB System-in-Package (SIP) chipset modules as well as the companion Open-Q RB1 and RB2 Development Kits. The two SIP modules are footprint compatible, allowing for flexibility in hardware design choice, and is offered in a Yocto Project environment suitable for developers to build an operating system based on the Linux kernel for their embedded and IoT devices. The SIP modules are powered by the Qualcomm® QRB2210 and Qualcomm® QRB4210 System-on-Chip (SoC) from Qualcomm Technologies Inc. Utilizing heterogeneous compute capabilities with multiple specialized processing cores, they deliver high-performance computing with lower power consumption. “As part of our leading robotics portfolio, the Qualcomm QRB2210 and Qualcomm QRB4210 provide a comprehensive, cost-effective solution to quickly deploy everyday robotics and IoT projects,” stated Dev Singh, vice president of Business Development and head of Building, Enterprise and Industrial Automation at Qualcomm Technologies Inc. “We are pleased to work with Lantronix and support its industrial-grade System-in-Package modules to simplify product design and enable customers to further improve time-to-market of their solutions.” By 2026, Berg Insights forecasts that roughly 260 million services robots will be active throughout the world, growing at a CAGR of 24 percent per year. Berg Insights forecasts that the three largest volume segments are floor-cleaning robots, UAVs and robot lawn mowers. “Qualcomm Technologies’ low-power capabilities improve battery life in these applications by integrating powerful heterogeneous compute capabilities and connectivity,” said Brian Jaroszewski, director of Product Line Management at Lantronix. “Our long-standing relationship with Qualcomm Technologies enables us to deliver a wide variety of development solutions and support the quick and cost-effective delivery of innovative ...