Press release
Lam Research, Entegris, Gelest Team Up to Advance EUV Dry Resist Technology Ecosystem
Collaboration provides robust chemical supply chain for global chipmakers using the breakthrough technology and supports R&D for next-generation EUV
About this update from Lam Research Corporation
[{"type":"text","content":"Collaboration provides robust chemical supply chain for global chipmakers using the breakthrough technology and supports R&D for next-generation EUV applications\nSAN FRANCISCO, July 12, 2022 /PRNewswire/ -- SEMICON WEST 2022 -- Lam Research Corp. (NASDAQ: LRCX), Entegris, Inc. (NASDAQ: ENTG), and Gelest, Inc, a Mitsubishi Chemical Group company, today announced a strategic collaboration that will provide semiconductor manufacturers worldwide with reliable access to precursor chemicals for Lam's breakthrough dry photoresist technology for extreme ultraviolet (EUV) lithography, an innovative approach used in the production of next-generation semiconductors. The parties will work together on EUV dry resist technology research and development (R&D) for future device generations of logic and DRAM products that will help enable everything from machine learning and artificial intelligence to mobile devices.\n\n \n \n \n \n \n \n\n \nA robust supply chain for process chemicals is critical to EUV dry resist technology integration into high-volume manufacturing. This new long-term collaboration further broadens the growing ecosystem for dry resist technology and will provide dual-source supply from semiconductor material leaders with provisions for continuity of delivery in all global markets.\nIn addition, Lam, Entegris, and Gelest will work together to accelerate the development of future cost-effective EUV dry resist solutions for high numerical aperture (high-NA) EUV patterning. High-NA EUV is widely seen as the patterning technology that will be required for continued device scaling and advancement of semiconductor technology over the coming decades. Dry resist provides the high etch resistance and tunable thickness scaling of deposition and development necessary to support high-NA EUV's reduced depth of focus requirements.\n\"Dry resist technology is a breakthrough that shatters the biggest barriers to scaling to future DRAM nodes and logic with EUV lithography,\" said Rick Gottscho, executive vice president and chief technology officer of Lam Research. \"This collaboration brings together Lam's dry resist expertise and cutting-edge solutions with material science capabilities and trusted supply channels from two industry precursor chemical leaders. This important expansion of the dry resist ecosystem paves the way for exciting new...