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Kulicke & Soffa to Showcase ULTRALUX™, RAPID™ and POWER-C™ at SEMICON China 2021
SINGAPORE, March 16, 2021 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company") announced today that
About this update from Kulicke And Soffa Industries, Inc.
[{"type":"text","content":"SINGAPORE, March 16, 2021 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) (\"Kulicke & Soffa\", \"K&S\" or the \"Company\") announced today that ongoing investments in development continue to extend the Company's value proposition within served markets. The Company is well positioned to support ongoing growth and business momentum as new product qualifications and order intake remain strong. \n\n \n \n \n \n \n \n\n \n5G technology adoption, electrification of the automotive market and a strong demand for consumer electronics are expected to support above average semiconductor growth over the coming years. This strong demand environment, combined with the rapid growth of increasingly complex assembly techniques, continues to drive the Company's strategy of developing high-performance, market-leading semiconductor equipment. \nK&S's ULTRALUX™ and RAPID™ series ball bonding systems along with advanced packaging solutions are engineered to create a differentiated interconnect solution for APU, RF module, AIP (antenna-in-package), memory and various SIPs supported by 5G and general semiconductor trends. The Company's POWER-C™ and Asterion™ series of wedge bonding solutions support the increasing demand for high-power devices, intelligent power modules and battery interconnects for electric vehicles.\nK&S will be demonstrating the capabilities of the RAPID™ architecture along with the POWER-C™ wedge bonder at the SEMICON China 2021 trade show from March 17 to 19, 2021 in Shanghai.\nThe POWER-C™ wedge bonder is engineered for single-row TO (transistor outline) package power devices. Its expanded pattern recognition capabilities deliver industry leading productivity and reliability. The POWER-C™ is driven by the same powerful direct-drive motion systems, bondheads, ultrasonic-generator systems and wire-feeding mechanisms, that are included within the proven PowerFusion™ and Asterion™ platforms. \n\"As the strong growth in the semiconductor and automotive markets continues, we remain committed to providing the industry with best-in-class systems and solutions that address the increasing complexity of semiconductor assembly. Our existing technology portfolio and development roadmaps are well positioned to extend our customers' long-term value propositions,\" said Chan Pin Chong, K&S's Executive Vice President, Products ...