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Kulicke & Soffa Joins Hi-CHIP - Heterogeneous Integration and Chiplet System Package Alliance
SINGAPORE, Dec. 12, 2022 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company") today announced the
About this update from Kulicke And Soffa Industries, Inc.
[{"type":"text","content":"SINGAPORE, Dec. 12, 2022 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) (\"Kulicke & Soffa\", \"K&S\" or the \"Company\") today announced the Company has joined the Heterogeneous Integration and Chiplet System Package Alliance (Hi-CHIP), an initiative led by the Taiwan-based Industrial Technology Research Institute (ITRI), in collaboration with other major industry players.\n\n \n \n \n \n \n \n\n \nThe Hi-CHIP alliance leverages Kulicke & Soffa's Advanced Packaging competencies and its LITEQ 500 lithography process enabling high-density redistribution layers (RDL). High-density RDL is an enabler for high-density fan-out wafer-level packaging (FOWLP) and similar approaches which provide performance, thermal management, power consumption and form-factor improvements to broad applications supporting telecommunications, computing, automotive, and biomedical markets.\nIn addition to providing a market-ready solution for emerging heterogenous applications, high-density RDL is also utilized within many other fast-growing applications including Antenna-in-Package for 5G mm Wave and sub-6 GHz RF modules; integrated solutions for baseband and smartphone application processors; artificial intelligence solutions integrated with RF and memory; and other transistor-dense applications such as System in Package. These emerging applications are anticipated to outpace semiconductor unit growth, driving demand for the Company's high-accuracy flip-chip, thermocompression and lithography systems, such as its LITEQ 500.\nKulicke & Soffa's LITEQ 500 lithography projection stepper uses a laser-based light source to provide high-intensity exposures without intensity degradation over time. This approach delivers high throughput, high uptime, long life, and low-cost of ownership. The single wavelength light source enables the use of high-transmission and low- aberrations optics, which makes it a compelling choice for high-density RDL applications.\nDr. Shih-Chieh Chang, General Director of ITRI's Electronic and Optoelectronic System Research Laboratories, expressed his excitement to have K&S on board with the Hi-CHIP Alliance, \"As an industry leader and pioneer, the addition of K&S, helps further explore future semiconductor assembly processes and solutions.\"\nWith the support from the Department of Industrial Technology, Ministry of...