Kulicke & Soffa Collaborates with UCLA

About this update from Kulicke And Soffa Industries, Inc.

[{"type":"text","content":"To Further Extend Advanced Packaging Technology and Solutions \nSINGAPORE, Aug. 8, 2023 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) (\"Kulicke & Soffa\", \"K&S\", \"we\" or the \"Company\") announced its expanded collaboration with The University of California, Los Angeles, Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) to deliver cost-effective advanced solutions which are needed within Artificial Intelligence (AI), high-performance computing (HPC) and data-center applications today. As the need for leading-edge packaging technology moves into higher-volume markets, yield, throughput and productivity are becoming increasingly important.\n\n \n \n \n \n \n \n\n \nK&S joined UCLA CHIPS as a charter member in 2016 to develop ultrafine pitch micro-bump interconnect solutions. Shortly after, thermocompression bonding (TCB) at 30µm micro-bump pitch became feasible. By leveraging formic acid treatment, K&S has demonstrated 10µm pitch capability in TCB. As heterogeneous chiplet packaging opportunities expand into higher-volume markets, K&S innovations have enhanced development engagements with key commercial customers, capable of enabling this broad and long-term industry transition.\nKulicke & Soffa's innovative fluxless process eliminates contamination concerns while ensuring interconnect integrity through an integrated delivery platform. The Company's high-accuracy, production-proven TCB portfolio is capable of supporting the majority of interposer-based, and 3D heterogeneous integration applications in the market today. K&S and UCLA's ongoing collaboration seeks to further develop manufacturable Cu-to-Cu solutions capable of sub-5µm pitch. The advantage of this TCB approach is that it is independent of dielectric specifics, and meets mil spec shear force, temperature cycling and moisture ingress standards.\n\"Capable advanced packaging solutions are critically necessary to overcome well-known node-shrink challenges and extend package-level transistor density. We continue to push the boundaries of technology and deliver high accuracy, high-throughput, and high-yield solutions which will accelerate the broader industry's transition to heterogeneous integration. We look forward to sustaining our leadership and technical progress as we continue broadening our advanced packaging solutions...

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