Business
Kulicke & Soffa Announces Thermo-Compression Adoption & Milestones
Several New Customer Wins as TCB Gains Commercial MomentumNew Path to Hybrid Bonding Demonstrated through Fluxless TCBK&S Joins Resonac-led "US-Joint"
About this update from Kulicke And Soffa Industries, Inc.
[{"type":"text","content":"Several New Customer Wins as TCB Gains Commercial MomentumNew Path to Hybrid Bonding Demonstrated through Fluxless TCBK&S Joins Resonac-led \"US-Joint\" Consortium\nSINGAPORE, Aug. 7, 2024 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) (\"Kulicke & Soffa\", \"K&S\", or the \"Company\") announced the introduction of its latest APTURA™ Thermo-Compression platform in addition to three new milestones relating to industry adoption of its chiplet-enabling Thermo-Compression technology.\n\nRecently, several of Kulicke & Soffa's leading Thermo-Compression offerings have been selected at multiple Assembly & Test customers. In support of the rapid needs for advanced chiplet and stacked-die requirements, these tools will support chip-to-substrate processes targeting applications such as AI, HPC, Mobile and Edge-devices. K&S also continues to pursue additional chip-to-wafer engagements and anticipates making further customer announcements over the coming quarter as its Thermo-Compression momentum, specifically in the area of Fluxless Thermo-Compression bonding (FTC), continues.\nAdditionally, through industry collaborations with the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS), as well as an FTC customer, Kulicke & Soffa's leading APTURA™ platform has demonstrated an alternative path to chip-to-wafer hybrid bonding, enabled by Thermo-Compression. This innovative bumpless-FTC process creates a true chip-to-wafer, hybrid-bond – supporting bonding for both bumpless, Copper-to-Copper interconnects as well as dielectric materials – for advanced logic applications. While direct Copper-to-Copper bonding is a standard feature of the APTURA platform and gathering broad market attention, this innovative new process further extends the market access for Kulicke & Soffa's broadening portfolio of Advanced Packaging solutions.\nFinally, on July 8th, Kulicke & Soffa's membership was announced within the \"US-Joint\" consortium, formed by Resonac Holdings Corporation (\"Resonac\"), a leading provider of global semiconductor materials. US-Joint is designed to support industry collaboration and market adoption of advanced packaging solutions through research and development and includes participation of ten American and Japanese semiconductor materials and equipment providers. After the initial establishment of...