Press release
KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
New portfolio drives chip performance with panel-based interconnect innovationKLA is extending the capability of the proven Corus™ direct imaging platform and
About this update from Kla Corporation
[{"type":"text","content":"New portfolio drives chip performance with panel-based interconnect innovationKLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging platform to support mainstream and advanced IC substrate lithography requirementsNew Lumina™ inspection and metrology systems further equip IC substrate (including glass core) and panel-based interposer makers to efficiently build advanced products with high quality and yieldMILPITAS, Calif., Oct. 15, 2024 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) introduced the industry's widest breadth of process control and process-enabling solutions for IC substrate (ICS) manufacturing. KLA's combined expertise in front-end semiconductors, packaging and IC substrates will help customers achieve breakthroughs in packaging interconnect density for chips targeting high-performance applications.\n\n \n \n \n \n \n \n\n \nAdvanced packaging continues to adopt heterogeneous integration methods to bring together multiple semiconductor components for performance, power and cost benefits. To meet evolving interconnect requirements, innovation is accelerating for panel-based intermediate packaging levels like IC substrates and interposers. These technologies are used to efficiently connect chips and printed circuit boards (PCBs). As package dimensions increase, feature sizes decrease and novel materials such as glass are introduced, manufacturers can leverage KLA's solution portfolio to achieve higher yield, accelerate delivery cycles and improve overall profitability.\nKLA's comprehensive portfolio of direct imaging (DI), defect inspection, shaping, metrology, chemistry process control and intelligent software solutions optimizes the advanced packaging manufacturing workflow.\nKLA's portfolio includes multiple direct imaging solutions supporting a range of customer lithography requirements. Market adoption of the Corus™ direct imaging platform demonstrates its proven capability at providing a highly flexible and efficient imaging solution. To meet evolving needs for applications like IC substrates and next-gen high-density interconnect (HDI), the capability is being extended with next-generation optics and lasers to optimize dynamic imaging and layer-to-layer accuracy at speed, even for varying panel topographies.\nFor advanced IC substrate appli...