Press release
KLA Introduces New IC Metrology Systems
Enabling high-performance logic and memory chip manufacturing MILPITAS, Calif., Feb. 24, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced
About this update from Kla Corporation
[{"type":"text","content":"Enabling high-performance logic and memory chip manufacturing\n\n\nMILPITAS, Calif., Feb. 24, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the Archer™ 750 imaging-based overlay metrology system and the SpectraShape™ 11k optical critical dimension (\"CD\") metrology system for integrated circuit (\"IC\" or \"chip\") manufacturing. As each layer in a chip is constructed, the Archer 750 helps verify that pattern features are correctly aligned to features on previous layers, while the SpectraShape 11k monitors the shapes of three-dimensional structures, such as transistors and memory cells, to ensure they remain in spec. By identifying subtle variations in pattern alignment or feature shape, these new metrology systems help IC manufacturers maintain strict control of the complex processes required to bring high-performance memory and logic chips to market, for applications such as 5G, AI, data centers, and edge computing.\n\n \n \n\n \n\"IC manufacturers are facing process tolerances measured on the atomic scale as they integrate novel structures and new materials into leading-edge chips,\" said Jon Madsen, senior vice president and general manager of the Metrology division at KLA. \"KLA plays a key part in ensuring that these chips can be manufactured cost-effectively with high quality standards. Today I'm proud to announce two additions to our portfolio of metrology solutions, representing the hard work and creative thinking of a top-notch, multi-disciplinary team of engineers and scientists. The new SpectraShape 11k and Archer 750 systems bring much-needed process control capabilities to our fab customers, helping them to produce the innovative electronics that move our world forward.\" \nThe Archer 750 overlay metrology system generates accurate and robust measurements of overlay error in the presence of process variation, while achieving productivity levels previously seen only with scatterometry-based overlay systems. This breakthrough system delivers accurate, fast feedback across a range of layers, helping lithographers identify process excursions inline and improve overall patterning integrity, for faster yield ramp and more stable production of advanced logic, DRAM and 3D NAND devices. \nThe SpectraShape 11k CD and dimensional shape metrology system provides an unprecedented combination of sensitivit...