Press release
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers
About this update from Intel Corporation
[{"type":"text","content":"\nGlass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products.\n\n\n SANTA CLARA, Calif.--(BUSINESS WIRE)--\nWhat’s New: Intel today announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore’s Law to deliver data-centric applications.\n\nThis press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230918184888/en/Hamid Azimi, corporate vice president and director of substrate technology development at Intel Corporation, holds an Intel assembled glass substrate test chip at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)\n“After a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come.”\n–Babak Sabi, Intel senior vice president and general manager of Assembly and Test Development\n\n\nWhy It Matters: Compared to today’s organic substrates, glass offers distinctive properties such as ultra-low flatness and better thermal and mechanical stability, resulting in much higher interconnect density in a substrate. These benefits will allow chip architects to create high-density, high-performance chip packages for data-intensive workloads such as artificial intelligence (AI). Intel is on track to deliver complete glass substrate solutions to the market in the second half of this decade, allowing the industry to continue advancing Moore’s Law beyond 2030.\n\n\nBy the end of the decade, the semiconductor industry will likely reach its limits on being able to scale transistors on a silicon package using organic materials, which use more power and include limitations like shrinkage and warping. Scaling is crucial to the progress and evolution of the semiconductor industry, and glass substrates are a viable and essential next st...