Press release
Intel to Invest $3.5 Billion to Expand New Mexico Manufacturing Operations
The Rio Rancho campus investment increases the manufacturing capacity of breakthrough advanced packaging technologies. RIO RANCHO, N.M.--(BUSINESS WIRE)--
About this update from Intel Corporation
[{"type":"text","content":"\nThe Rio Rancho campus investment increases the manufacturing capacity of breakthrough advanced packaging technologies.\n\n RIO RANCHO, N.M.--(BUSINESS WIRE)--\nWhat’s New: Intel Corporation will invest $3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Foveros, Intel’s breakthrough 3D packaging technology. The multiyear investment is expected to create at least 700 high-tech jobs and 1,000 construction jobs and support an additional 3,500 jobs in the state. Planning activities begin immediately, with construction expected to start in late 2021.\nThis press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210503005783/en/New Mexico Gov. Michelle Lujan Grisham (left) and Keyvan Esfarjani, Intel senior vice president and general manager of Manufacturing and Operations, display a plaque with a processor wafer on Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During a news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)\n“A key differentiator for our IDM 2.0 strategy is our unquestioned leadership in advanced packaging, which allows us to mix and match compute tiles to deliver the best products. We’re seeing tremendous interest in these capabilities from the industry, especially following the introduction of our new Intel Foundry Services. We’re proud to have invested in New Mexico for more than 40 years and we see our Rio Rancho campus continuing to play a critical role in Intel’s global manufacturing network in our new era of IDM 2.0.”\n\n–Keyvan Esfarjani, Intel senior vice president and general manager of Manufacturing and Operations\n\nWhat Foveros Is: Foveros advanced 3D packaging technology enables Intel to build processors with compute tiles stacked vertically, rather than side-by-side, providing greater performance in a smaller footprint. It also allows Intel to mix and match compute tiles to optimize for cost and power efficiency. The move from system-on-chip to “system on package” will enable Intel to meet increasing computing performance needs for artificial intelligence, 5G and the edge.\n\nWhy It Matters: Intel’s global factory networ...