Press release
Intel Innovation 2023: Empowering Developers to Bring AI Everywhere
Artificial intelligence gives rise to the ‘Siliconomy,’ a new era of global expansion driven by the magic of silicon and software. NEWS HIGHLIGHTS Intel
About this update from Intel Corporation
[{"type":"text","content":"\nArtificial intelligence gives rise to the ‘Siliconomy,’ a new era of global expansion driven by the magic of silicon and software. NEWS HIGHLIGHTS\n\n\n\nIntel confirmed its five-nodes-in-four-years process technology plan remains on track, and it demonstrated the world’s first multi-chiplet package using Universal Chiplet Interconnect Express (UCIe) interconnects.\n\n\n\nThe company revealed new details on next-generation Intel® Xeon® processors, including major advances in power efficiency and performance, and an E-core processor with 288 cores. 5th Gen Intel® Xeon® processors will launch Dec. 14\n\n\n\nThe AI PC arrives with the launch of Intel® Core™ Ultra processors on Dec. 14. With Intel’s first integrated neural processing unit, Core Ultra will deliver power-efficient AI acceleration and local inference on the PC.\n\n\n\nA large AI supercomputer will be built on Intel Xeon processors and Intel® Gaudi®2 AI hardware accelerators, with Stability AI as the anchor customer.\n\n\n\nGeneral availability announced for the Intel® Developer Cloud for building and testing high-performance applications like AI, including details that it is already in use by customers.\n\n\n\nNew and forthcoming Intel software solutions, including the 2023.1 release of the Intel® Distribution of OpenVINO™ toolkit, will help developers unlock new AI capabilities.\n\n\n\n SAN JOSE, Calif.--(BUSINESS WIRE)--\nAt its third annual Intel Innovation event, Intel unveiled an array of technologies to bring artificial intelligence everywhere and make it more accessible across all workloads, from client and edge to network and cloud.\n\nThis press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230919339712/en/A photo shows a tray of Intel Core Ultra processors being assembled at Intel’s advanced packaging facilities in Penang, Malaysia. The Intel Core Ultra processor, code-named Meteor Lake, is the first client processor manufactured on the new Intel 4 process node using its 3D high-performance hybrid architecture, and the first client tile-based design enabled by Foveros packaging technology and features CPU, GPU and NPU. (Credit: Intel Corporation)\n“AI represents a generational shift, giving rise to a new era of global expansion where computing is even more foundational to a better future for all,” said Int...