Press release
Intel Hybrid Processors: Uncompromised PC Experiences for Innovative Form Factors Like Foldables, Dual Screens
SANTA CLARA, Calif.--(BUSINESS WIRE)-- What’s New: Today, Intel launched Intel® Core™ processors with Intel® Hybrid Technology, code-named “Lakefield.”
About this update from Intel Corporation
[{"type":"text","content":" SANTA CLARA, Calif.--(BUSINESS WIRE)--\nWhat’s New: Today, Intel launched Intel® Core™ processors with Intel® Hybrid Technology, code-named “Lakefield.” Leveraging Intel’s Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative form factors.\nThis press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20200610005143/en/In June 2020, Intel launches \"Lakefield,\" Intel Core processors with Intel Hybrid Technology. The processor leverages Intel’s Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability. Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative form factors. (Credit: Intel Corporation)\n\n“Intel Core processors with Intel Hybrid Technology are the touchstone of Intel’s vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs. Combined with Intel’s deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future.”\n\n\n–Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms\n\n\nWhy They’re Great for Innovative PC Form Factors: Intel Core processors with Intel Hybrid Technology deliver full Windows 10 application compatibility in up to a 56% smaller package area for up to 47% smaller board size1 and extended battery life, providing OEMs more flexibility in form factor design across single, dual and foldable screen devices while delivering the PC experiences people expect. They are also:\n\n\n\nThe first Intel Core processors shipping with attached package-on-package (PoP) memory, further reducing board size.\n\n\nThe first Intel Core processors to deliver as low as 2.5mW of standby SoC power – an up to 91% reduction compared to Y-series processors – for more time between charges2.\n\n\nThe first Intel processors to feature native dual internal display pipes, making ...