Press release
Intel, Ericsson Expand Collaboration to Advance Next-Gen Optimized 5G Infrastructure
Intel to manufacture future custom 5G SoC for Ericsson on 18A process technology NEWS HIGHLIGHTS Announcement signals confidence in 18A process technology
About this update from Intel Corporation
[{"type":"text","content":"\nIntel to manufacture future custom 5G SoC for Ericsson on 18A process technology\n\n\nNEWS HIGHLIGHTS\n\n\n\nAnnouncement signals confidence in 18A process technology and underscores progress on Intel’s five-nodes-in-four-years roadmap to regain process leadership.\n\n\n\nNews shows continued collaboration between the companies to optimize standard Intel® Xeon® Scalable processor-based platforms for Ericsson’s Cloud RAN solutions.\n\n\n\nIndustry leaders advance the adoption of 5G, building sustainable and resilient networks of the future.\n\n\n\n SANTA CLARA, Calif.--(BUSINESS WIRE)--\nToday, Intel announced a strategic collaboration agreement with Ericsson to utilize Intel’s 18A process and manufacturing technology for Ericsson’s future next-generation optimized 5G infrastructure.\n\n\nAs part of the agreement, Intel will manufacture custom 5G SoCs (system-on-chip) for Ericsson to create highly differentiated leadership products for future 5G infrastructure. Additionally, the companies will expand their collaboration to optimize 4th Gen Intel® Xeon® Scalable processors with Intel® vRAN Boost for Ericsson’s Cloud RAN (radio access network) solutions to help communications service providers increase network capacity and energy efficiency while gaining greater flexibility and scalability.\n\n\n“As our work together evolves, this is a significant milestone with Ericsson to partner broadly on their next-generation optimized 5G infrastructure. This agreement exemplifies our shared vision to innovate and transform network connectivity, and it reinforces the growing customer confidence in our process and manufacturing technology,” said Sachin Katti, senior vice president and general manager of the Network and Edge group at Intel. “We look forward to working together with Ericsson, an industry leader, to build networks that are open, reliable and ready for the future.”\n\n\n18A is Intel's most advanced node on the company's five-nodes-in-four-years roadmap. After new gate-all-around transistor architecture – known as RibbonFET – and backside power delivery – called PowerVia – appear first in Intel 20A, Intel will deliver ribbon architecture innovation and increased performance along with continued metal linewidth reduction in 18A. Combined, these technologies will put Intel back in the process leadership position in 2025, elevating f...