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Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers

MOUNTAIN VIEW, Calif. & HSINCHU, Taiwan, January 27, 2026--Lightmatter®, the leader in photonic interconnect solutions for AI, and Global Unichip Corp. (GUC), the Advanced ASIC leader and a key enabler for hyperscaler AI infrastructure, today announced a strategic partnership to bring commercial Passage™ 3D Co-Packaged Optics (CPO) solutions to market.

articleGlobal Unichip Corp.January 26, 20264/company/global-unichip-corp/news/lightmatter-and-guc-partner-to-produce-co-packaged-optics-cpo-solutions-for-ai-hyperscalers
Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers

About this update from Global Unichip Corp.

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GUCGlobal Unichip Corp.interconnect solutionsASICHSINCHU, Taiwansilicon photonics