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Grant Funding Project Win

Grant Funding Project Win.

articleFiltronic PlcSeptember 18, 20234/company/filtronic/news/grant-funding-project-win
Grant Funding Project Win

About this update from Filtronic Plc

[{"type":"text","content":"\n\n18 September 2023\nFiltronic plc\n(\"Filtronic\" or the \"Company\")\n \nGRANT FUNDING PROJECT WIN\n \nFiltronic plc (AIM: FTC), the designer and manufacturer of products for the aerospace, defence, telecoms infrastructure, space and critical communications markets, is pleased to announce it has been selected by the Defence and Security Accelerator (\"DASA\"), part of the UK Ministry of Defence (\"MoD\"), for the prestigious Defence Technology Exploitation Programme (\"DTEP\"), supported by Innovate UK. The scheme, sponsored by the MOD's Directorate of Industrial Strategy and Exports (\"DISE\"), aims to foster innovation and enhance defence supply chains by supporting small and medium-sized enterprises in developing state-of-the-art materials, technologies and processes. The total grant funding to be received by Filtronic is £170,000 in addition to a further £76,000 worth of support from our lead customer to help embed the technology and capability into the business.\n \nUnder the DTEP award, Filtronic will undertake a groundbreaking project titled \"Low cost and SWAP high density packaging for future RADAR\" designed to develop a specialist, plastic encapsulation capability for compound semiconductor devices, focusing on high-density System in Package (\"SiP\") designs. The project will prioritise low-weight, low-cost, high-density packaging for high-power semiconductor devices, specifically designed to perform in challenging operational environments for the MoD, Royal Navy, Royal Air Force, and their global allies.\n \nFiltronic is collaborating with a major aerospace and defence company to manufacture and test plastic encapsulated Transmit Receive Modules (\"TRMs\") for electronically scanned radar systems. The TRMs use the latest high power density compound semiconductor materials. Plastic encapsulation is much lighter and significantly cheaper compared to ceramic alternatives. Initially to be used in airborne radars, it is applicable to other detector, sensor and communication systems for defence and commercial applications.\n \nRichard Gibbs, Chief Executive Officer, commented: \"This opportunity not only demonstrates our technological expertise but also strengthens our commitment to supporting the UK's defence industry, it's sovereign supply chain and future radar programmes. Filtronic's ...

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