Business
Business Update
Ethernity Networks Ltd. provided a business update highlighting confidence in securing an ASSP partnership and anticipating increased royalty revenues in 2026 from a long-standing OEM customer following a second ASIC development under an $800k agreement. The company also reported an order for an additional 2,000 unit licenses from Tier-1 U.S. PON vendors and successful product market delivery for a Tier-1 U.S. defense and aerospace customer, with further platform-use licenses expected in 2026. Ethernity is expanding its FPGA portfolio with a new low-latency solution targeting defense, mobile, and IoT applications. Disclaimer*
About this update from Ethernity Networks Ltd.
[{"type":"text","content":"\n\n11 December 2025\n \nEthernity Networks Ltd\n(\"Ethernity\" or the \"Company\")\n \nBusiness Update\n \nEthernity Networks Limited (AIM: ENET.L; OTCMKTS: ENETF), a leading supplier of data processing semiconductor technology for networking appliances and PON, provides an update on its current business and plans for 2026.\n \nHighlights\n· The Company is confident in its ability to secure a partnership for the ASSP opportunity.\n· A long-standing OEM customer completed its second ASIC development earlier this year under the $800k agreement signed in November 2023. The Company anticipates increased royalty revenues from this engagement during 2026.\n· Tier-1 U.S. PON vendors have placed an order for an additional 2,000 unit licenses.\n· A Tier-1 U.S. defense and aerospace customer has successfully delivered a product to market based on the Company's IP. Close development collaboration continues, and the customer is expected to purchase additional platform-use licenses in 2026.\n· The Company is expanding its FPGA portfolio with a new low-latency solution targeting Defence, Mobile, and Internet-of-Things (IoT) applications.\n.\nApplication-specific standard product (\"ASSP\") Opportunity\n \nThe Company remains confident in securing a partnership for the development of its planned ASSP device, which is designed to address large and diverse markets, including wireless backhaul through the integration of the Company patented L1 bonding, carrier ethernet, and broadband access through the combination of the PON functionality as a complete Optical Line Termination (\"OLT\") on a chip.\n \nThe ASSP will be architected as a true multi-platform solution, deployable across a wide range of systems such as cell-site routers, microwave backhaul Indoor Units (\"IDU\"), PON OLTs, compact carrier Ethernet switches, enterprise gateways, and 5G edge units. This broad applicability would create a strong foundation for large-scale commercial opportunities for both partners and OEMs. A growing number of leading OEMs have expressed interest in receiving the ASSP and acting as early adopters.\n \nFor partners, the solution offers a compelling advantage as ...