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EnSilica Agrees a Multimillion Pound Contract
EnSilica Agrees a Multimillion Pound Contract.

About this update from Ensilica Plc
[{"type":"text","content":"\n\nThe information contained within this announcement was deemed by the Company to constitute inside information as stipulated under the UK Market Abuse Regulation.\n \n24 March 2025\n \n EnSilica plc \n(\"EnSilica\", the \"Company\" or the \"Group\") \n \nEnSilica Agrees a Multimillion Pound Design and Manufacturing Services Contract\n \nIncreased demand leads to second design centre in Brazil\n \nEnSilica plc (AIM:ENSI), a leading chip maker of mixed signal ASICs (\"Application Specific Integrated Circuits\"), is pleased to announce that it has been awarded a multimillion-pound design and manufacturing services contract by a well-funded pioneering optical computing systems company (the \"Contract\").\n \nThe Contract includes substantial design services engagement and additional manufacturing services. Following the completion of an initial study phase, activity will now increase significantly, with revenues contributing to EnSilica's current and the following two financial years.\n \nThis addition to EnSilica's offerings stems from strengthened relationships with key wafer foundry and semiconductor supply chain partners. This now allows EnSilica to provide wafers, packages, and tested devices along with design services. This model, successfully executed by several Asian companies including Socionext, Alchip, and Global Uni Chip (GUC), is now being leveraged by the Company to meet the growing demand for a resilient European-based supply chain.\n \nFinally, and due to increased demand, EnSilica has opened a second design centre in Campinas, São Paulo State, Brazil. This location, with its strong semiconductor ecosystem, has enabled the rapid growth of EnSilica's existing engineering team in the region.\n \n \nIan Lankshear, CEO of EnSilica, commented:\n \n\"We are pleased to secure this sizable contract with a pioneering optical computing systems company. This agreement not only underscores our capabilities in delivering comprehensive design and manufacturing services but also highlights the growing demand for European-based supply chains.\n \nOur strengthened relationships with key wafer foundry and semiconductor supply chain partners enable us to provide high-quality wafers, packages, and completed tested devices.\n \nWe are also delighted to be opening our sec...