Business
Sivers Semiconductors and Doosan Partner to Develop Leading-Edge Ka-Band SATCOM Antenna Panels
Sivers Semiconductors AB (STO:SIVE), a global leader in photonics and wireless technologies, today announced a new collaboration with Doosan Corporation, a global leader in advanced materials and manufacturing solutions, to develop scalable electronically steerable array (ESA) panels in the Ka-band for satellite communications (SATCOM). The contract, valued at USD $1.5 million, will fund the design and development of these advanced antenna systems, powered by Sivers' upcoming broad-market Ka-ban
About this update from Doosan Corporation
[{"type":"text","content":"Collaboration aims to advance scalable electronically steerable array (ESA) technology for Korea's strategic satellite communications ecosystem","length":152,"tagName":"p","attribs":{}},{"type":"text","content":"KISTA, Sweden, Nov. 25, 2025 /PRNewswire/ -- Sivers Semiconductors AB (STO:SIVE), a global leader in photonics and wireless technologies, today announced a new collaboration with Doosan Corporation, a global leader in advanced materials and manufacturing solutions, to develop scalable electronically steerable array (ESA) panels in the Ka-band for satellite communications (SATCOM). The contract, valued at USD $1.5 million, will fund the design and development of these advanced antenna systems, powered by Sivers' upcoming broad-market Ka-band SATCOM beamforming integrated circuits (BFICs).","length":608,"tagName":"p"},{"type":"text","content":""Our strategic collaboration with Doosan marks an important milestone for Sivers as we expand our footprint in the global SATCOM market," said Vickram Vathulya, CEO of Sivers Semiconductors. "Our Ka-band BFICs deliver industry-leading efficiency and performance, enabling multi-beam, multi-orbit connectivity that is essential for future SATCOM systems. With the addition of Doosan's advanced manufacturing and system integration capabilities, our technology can achieve new levels of scalability and reliability in ESA architectures."","length":559,"tagName":"p"},{"type":"text","content":"Under the agreement, Sivers will supply its industry-leading Ka-band SATCOM BFICs - highly-integrated front-end chips that offer high transmit output power, low receive noise figure and best-in-class energy efficiency. These BFICs enable simultaneous multi-beam operation, allowing communication with multiple satellites across multiple orbits, and support 'make-before-break' handover to ensure uninterrupted connectivity for both fixed and mobile SATCOM terminals. Sivers will also develop the scalable electronically-steered antenna (ESA) panels, leveraging its extensive in-house experience in large-scale antenna array design.","length":639,"tagName":"p"},{"type":"text","content":"Doosan will lead manufacturing and system testing for the ESA panels, combining its established expertise in high-precision fabrication with Sivers' state-of-the-art semic...