Technology
BOS Semiconductors Selects Ceva's AI DSP for Next-Generation ADAS Platforms
As vehicles evolve toward software-defined architectures and complex ADAS, the industry is turning to real-time sensor processing, safety-critical...
About this update from Ceva, Inc.
[{"type":"text","content":"Eagle-A leverages SensPro™ to accelerate LiDAR and radar sensing workloads for real-time perception and sensor fusion","length":122,"tagName":"p","attribs":{}},{"type":"text","content":"LAS VEGAS , Jan. 6, 2026 /PRNewswire/ -- As vehicles evolve toward software-defined architectures and complex ADAS, the industry is turning to real-time sensor processing, safety-critical intelligence, and physical AI to bridge perception and actuation. In line with this trend, Ceva, Inc. (NASDAQ: CEVA) today announced that BOS Semiconductors has licensed its SensPro™ AI DSP architecture for the Eagle-A standalone ADAS System-on-Chip (SoC).","length":454,"tagName":"p"},{"type":"image","alt":"Ceva’s SensPro AI DSP enhances real‑time perception and safety‑critical intelligence in BOS Semiconductors’ Eagle‑A automotive SoC.","displaySize":"","headline":null,"caption":"Ceva’s SensPro AI DSP enhances real‑time perception and safety‑critical intelligence in BOS Semiconductors’ Eagle‑A automotive SoC.","className":"","disableSlideshowImg":false,"size":{"original":{"width":400,"height":209,"url":"https://media.zenfs.com/en/prnewswire.com/cb52544151775f0e82b23cbe9939297b"},"resized":{"url":"https://s.yimg.com/ny/api/res/1.2/zhihkDRBGNrafNRntql66Q--/YXBwaWQ9aGlnaGxhbmRlcjt3PTcwNTtoPTM2ODtjZj13ZWJw/https://media.zenfs.com/en/prnewswire.com/cb52544151775f0e82b23cbe9939297b","width":400,"height":209}},"href":"https://mma.prnewswire.com/media/2854002/Ceva_PR_BOS_Social_251030_v1.html","hrefExternal":true,"rel":"nofollow"},{"type":"text","content":"Eagle-A is designed for advanced driver assistance and autonomous driving systems, combining a high-end NPU, CPU and GPU with dedicated sensing interfaces for camera, LiDAR, and radar fusion. Ceva's SensPro AI DSP is optimized for LiDAR and radar pre-processing, enabling efficient handling of raw sensor data and reducing latency in perception pipelines. BOS Semiconductors' chiplet strategy further enhances scalability, with Eagle-A designed to work alongside the Eagle-N AI accelerator in multi-die configurations connected via UCIe and PCIe. This approach enables OEMs to tailor compute performance for diverse ADAS and autonomous driving requirements. In addition, the modular design of BOS's Eagle series enables flexible deployment across edge AI a...