Press release
Cadence Wins Six 2022 TSMC OIP Partner of the Year Awards
Highlights: TSMC presented Cadence with awards for key EDA, cloud and IP innovations Cadence recognized as a founding member of TSMC 3DFabric Alliance SAN
About this update from Cadence Design Systems, Inc.
[{"type":"text","content":"\nHighlights:\n\n\nTSMC presented Cadence with awards for key EDA, cloud and IP innovations\n\n\nCadence recognized as a founding member of TSMC 3DFabric Alliance\n\n\n SAN JOSE, Calif.--(BUSINESS WIRE)--\nCadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has won six Open Innovation Platform® (OIP) Partner of the Year awards from TSMC for its EDA, IP and cloud solutions. Cadence was presented with awards for the joint development of the N3E design infrastructure, 3Dblox™ Design Solution, analog migration flow, RF design solutions, cloud-based productivity solution and DSP IP. In addition, Cadence was recognized as a founding member of the TSMC 3DFabric™ Alliance.\n\nThe awards and 3DFabric Alliance member recognition are based on the collaborative work with TSMC highlighted below:\n\n\nN3E Design Infrastructure: Cadence worked closely with TSMC to optimize the complete, integrated digital implementation and signoff flow and custom/analog flow for the TSMC N3E process technology to enable customers to achieve power, performance and area (PPA) targets and accelerate time to market.\n\n\n3Dblox™ Design Solution: The leading Cadence® Integrity™ 3D-IC platform achieved certification and met all reference flow criteria for TSMC’s 3DFabric offerings. In addition, the companies worked together to develop TSMC’s latest 3Dblox™ standard and Cadence’s Advanced Substrate Router (ASR) to help customers accelerate advanced multi-die package design.\n\n\nAnalog Migration Flow: Cadence worked with TSMC to develop a node-to-node process migration flow built upon the Cadence Virtuoso® design platform for custom/analog IC blocks that use TSMC’s advanced node technologies. The collaboration ensures that customers can automatically migrate a source design in a given TSMC N5 or N4 process to a new design on N3E process technology.\n\n\nRF Design Solutions: Cadence and TSMC collaborated on an RF design reference flow to accelerate mmWave design projects that utilize the TSMC N16RF semiconductor technology for the creation of next-generation mobile and 5G applications.\n\n\nCloud-Based Productivity Solution: Cadence expanded its cloud collaboration with TSMC by accelerating the physical verification of giga-scale digital designs via the Cadence Pegasus™ Verification System, which enables customers to speed design schedules and reduce ...