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Cadence Unveils Clarity 3D Solver, Delivering Unprecedented Performance and Capacity for System Analysis and Design
BENGALURU, April 3, 2019 /PRNewswire/ -- Announcement marks Cadence's expansion into fast-growing system analysis and design market Highlights: The first
About this update from Cadence Design Systems, Inc.
[{"type":"text","content":"BENGALURU, April 3, 2019 /PRNewswire/ --\n\nAnnouncement marks Cadence's expansion into fast-growing system analysis and design market \n\nHighlights:\n\n\nThe first product in Cadence's system analysis initiative, the Clarity 3D Solver delivers up to 10X faster performance for electromagnetic simulation with virtually unlimited capacity and gold-standard accuracy \n\nNew breakthrough architecture can run on hundreds of CPUs optimized for both cloud and on-premises distributed computing \n\nTrue 3D model extraction eliminates risk from manually reducing the size of structures being modeled \n\nEasily reads design data from all standard chip and IC package platforms and offers unique integration with Cadence implementation platforms \n\n\n\nCadence Design Systems, Inc. (NASDAQ: CDNS) today entered the fast-growing system analysis and design market with the announcement of the Cadence® Clarity™ 3D Solver, which delivers gold-standard accuracy with up to 10X faster simulation performance and unbounded capacity compared to legacy field solver technology. Harnessing state-of-the-art distributed multiprocessing technology, the Clarity 3D Solver efficiently tackles electromagnetic (EM) challenges encountered when designing complex 3D structures on chips, packages, PCBs, connectors and cables-bringing true 3D analysis to any engineer with desktop, high-performance computing (HPC) or cloud computing resources. The Clarity 3D Solver easily reads design data from all standard chip, IC package and PCB implementation platforms while also providing unique integration benefits for design teams using the Cadence Allegro® and Virtuoso® implementation platforms. For more information, please visit http://www.cadence.com/go/3dsolver.\n\nHighly complex structures found in silicon interposers, rigid-flex PCBs and stacked-die IC packages must be modeled accurately in 3D for structure optimization and high-speed signaling compliance. High-speed signaling, such as in 112G serializer/deserializer (SerDes) interfaces, relies on high-fidelity interconnect design. Any slight change in impedance can negatively impact bit error rate, so optimization entails extensive research including dozens of complex extractions and simulations. To accommodate this workload, legacy field solvers must run on massive, expensive high-performance servers. In addition, speed an...