Press release
Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
Strategic collaborations with Samsung Foundry, Arm and others enable Cadence to deliver pre-validated chiplet solutions based on the Cadence Physical AI
About this update from Cadence Design Systems, Inc.
[{"type":"text","content":"\nStrategic collaborations with Samsung Foundry, Arm and others enable Cadence to deliver pre-validated chiplet solutions based on the Cadence Physical AI chiplet platform\n\n\n SAN JOSE, Calif.--(BUSINESS WIRE)--\nCadence (Nasdaq: CDNS) today announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical AI, data center, and high-performance computing (HPC) applications. Initial IP partners joining Cadence include Arm, Arteris, eMemory, M31 Technology, Silicon Creations and Trilinear Technologies, as well as silicon analytics partner proteanTecs. To help reduce risk and streamline customer adoption, Cadence is collaborating with Samsung Foundry to build out a silicon prototype demonstration of the Cadence® Physical AI chiplet platform, including pre-integrated partner IP on the Samsung Foundry SF5A process.\n\nThis press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260106077060/en/Cadence's Chiplet Spec-to-Packaged Parts ecosystem reduces engineering complexity and accelerates time to market for customers developing chiplets targeting physical AI, data center, and HPC applications.\nExtending their longstanding history of close collaboration, Cadence and Arm are working together to accelerate innovation across physical and infrastructure AI applications. Cadence will leverage the advanced Arm® Zena™ Compute Subsystem (CSS) and other essential IP to enhance Cadence’s Physical AI chiplet platform and Chiplet Framework. The resulting new Cadence solutions accommodate the demanding next-generation edge AI processing requirements for automobiles, robotics and drones, as well as the needs of standards-based I/O and memory chiplets for data center, cloud and HPC applications. The alliances reduce engineering complexities, offer customers a low-risk path to advanced chiplet adoption and pave the way for smarter, safer and more efficient systems.\n\n\n“Cadence’s new chiplet ecosystem represents a significant milestone in chiplet enablement,” said David Glasco, vice president of the Compute Solutions Group at Cadence. “Multi-die and chiplet-based architectures are increasingly critical to achieving greater performance and cost efficiency amid growing design complexity. Cadence’s ch...