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Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud
Highlights: Customers benefit from improved productivity and scalability with Cadence signoff solutions and TSMC technology on the Microsoft Azure cloud with
About this update from Cadence Design Systems, Inc.
[{"type":"text","content":"\nHighlights:\n\n\nCustomers benefit from improved productivity and scalability with Cadence signoff solutions and TSMC technology on the Microsoft Azure cloud with the Cadence CloudBurst Platform\n\n\nCadence Tempus Timing Signoff Solution demonstrated distributed scalability on a 10+ billion transistor design while reducing compute costs for maximum efficiency\n\n\n SAN JOSE, Calif.--(BUSINESS WIRE)--\nCadence Design Systems, Inc. (Nasdaq: CDNS) today announced the results of the 2021 three-way collaboration with TSMC and Microsoft, which focused on utilizing a cloud infrastructure to accelerate digital timing signoff of 10+ billion transistor designs. These large designs are the heart of advanced applications such as hyperscale computing, graphics and machine learning (ML) applications. Given the enormous size of these designs, engineering teams are constantly challenged to meet schedule and compute budget. Through this collaboration, common customers can accelerate their signoff schedule and reduce compute cost by adopting the Cadence® Tempus™ Timing Signoff Solution and TSMC technologies using the ready-to-use Cadence CloudBurst™ Platform and Microsoft Azure Cloud.\n\nFor details on the collaboration, a new white paper is available immediately for customer download at TSMC-Online at https://online.tsmc.com/online/. This white paper contains cloud scaling strategies focused on distributed execution, detailed illustrations of the Cadence Tempus Timing Signoff Solution cloud execution, sample scripts, Cadence CloudBurst reference architecture and Microsoft’s Azure Cloud IT best practices.\n\n“Semiconductor designers are consistently pushing the boundaries to create increasingly large designs, and it’s critical for design teams to meet their tight product schedules,” said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. “Over the past year, our close collaboration with Cadence and Microsoft through the TSMC OIP Cloud Alliance has given our mutual customers access to our advanced technologies, Cadence signoff solutions and cloud portfolio as well as Microsoft’s Azure platform to seamlessly handle giga-scale designs and quickly launch their differentiated products to market.”\n\nMujtaba Hamid, general manager, Silicon, Modeling & Simulation at Microsoft Azure added, “Microsoft’s Azure Cloud platfo...