Press release
Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
ADAS chiplet reference design and software development platform based on the latest Automotive Enhanced technologies from Arm accelerate time-to-market for
About this update from Cadence Design Systems, Inc.
[{"type":"text","content":"\nADAS chiplet reference design and software development platform based on the latest Automotive Enhanced technologies from Arm accelerate time-to-market for SDVs\n\n\n SAN JOSE, Calif.--(BUSINESS WIRE)--\nCadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration with Arm to deliver a chiplet-based reference design and software development platform to accelerate software-defined vehicle (SDV) innovation. The automotive reference design, initially for advanced driver assistance system (ADAS) applications, specifies a scalable chiplet architecture and interface interoperability to foster industry-wide collaboration, enable heterogeneous integration and expand system innovation.\n\n\nThe solution is architected and built using the latest generation of Arm® Automotive Enhanced technologies and Cadence® IP. The complementary software stack development platform is provided as a digital twin of the hardware that is compliant with the Scalable Open Architecture for Embedded Edge (SOAFEE) initiative software standard, enabling software development to begin before hardware is available and allowing subsequent system integration validation. The combined solution speeds both hardware and software development, accelerating time-to-market.\n\n\nThe growing prevalence of ADAS and SDVs is driving the need for more complex AI and software capabilities, as well as greater levels of interoperability and collaboration in the automotive electronics ecosystem. Coupled with the need to quickly customize 3D-IC systems for a plethora of automotive applications, chiplets are an increasingly attractive solution. However, it’s crucial that chiplets from different IP providers work together seamlessly. In addition, the rapid pace of automotive development necessitates that 3D-IC system developers have a software development platform to shift left in the process flow while the IP and chiplets are still being designed.\n\n\nThe new solution architecture and reference design provide a standard for chiplet interface interoperability, addressing a critical industry need. The Cadence components of the solution include:\n\n\n\nHelium™ Virtual and Hybrid Studio for the rapid creation of virtual and hybrid platforms and Helium Software Digital Twin to support deployment at scale for software developers\n\n\n\nI/O IP solutions for industry-leading i...