Business
Cadence Cerebrus AI-Based Solution Delivers Transformative Results on Next-Generation Customer Designs
Highlights: MediaTek shrinks die area by 5% and reduces power by more than 6% with the Cadence Cerebrus floorplan optimization feature Cadence collaborates
About this update from Cadence Design Systems, Inc.
[{"type":"text","content":"\nHighlights:\n\n\nMediaTek shrinks die area by 5% and reduces power by more than 6% with the Cadence Cerebrus floorplan optimization feature\n\n\nCadence collaborates with Renesas to deploy Cadence Cerebrus on two designs; achieves better performance on an advanced-node CPU design and a leakage power reduction on an MCU design\n\n\n SAN JOSE, Calif.--(BUSINESS WIRE)--\nCadence Design Systems, Inc. (Nasdaq: CDNS) today announced that customer adoption of the Cadence® Cerebrus™ Intelligent Chip Explorer is accelerating with new production deployments completed. Given that Cadence Cerebrus employs artificial intelligence (AI) technology to automate and scale digital chip design, it offers customers the compelling value proposition of optimized power, performance and area (PPA) and improved engineering productivity.\n\nCadence Cerebrus is a transformational AI-driven technology that has a unique reinforcement learning engine, which automatically optimizes tool and chip design options to deliver better PPA with significantly less engineering effort and overall time to tapeout. As one example, the Cadence Cerebrus floorplan optimization feature enables customers to shrink the die size beyond a human’s design potential. As a result, Cadence Cerebrus, when coupled with the broader Cadence digital product portfolio, provides a breakthrough engineering benefit with the industry’s most advanced digital full flow, from synthesis through implementation and signoff.\n\n“We’re always looking for new ways to empower our customers to be more productive, and Cadence Cerebrus minimizes manual work through its AI capabilities so design engineers can focus on more critical projects,” said Dr. Chin-Chi Teng, senior vice president and general manager, Digital & Signoff Group at Cadence. “We launched Cadence Cerebrus less than a year ago, and it’s been remarkable to see how quickly our customers got up and running and started realizing the full potential of the product. Customers like MediaTek and Renesas have seen such positive PPA and productivity results that they’ve now adopted the tool widely for production flows.”\n\nMediaTek Production Adoption\n\nMediaTek is a leading fabless semiconductor company whose products power more than 2 billion connected devices across mobile, smart home, connectivity and AIoT products a year.\n\n“At MediaTek, we are...