Business
Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026
Spotlighting end-to-end AI infrastructure portfolio for gigawatt-scale clusters – spanning XPU, Ethernet, Optics, SerDes, DSP, and PCIe solutionsPALO ALTO, Calif., March 12, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading
About this update from Broadcom Inc.
[{"type":"image","alt":"Broadcom Inc.","displaySize":"","headline":null,"caption":"Broadcom Inc.","className":"","disableSlideshowImg":false,"size":{"original":{"width":300,"height":88,"url":"https://media.zenfs.com/en/globenewswire.com/6df6674bbaeba14da317878add1c3ee2"},"resized":{"url":"https://s.yimg.com/ny/api/res/1.2/qKzaUj2j7AwfqYbXDYkXCQ--/YXBwaWQ9aGlnaGxhbmRlcjt3PTQyMDtoPTEyMztjZj13ZWJw/https://media.zenfs.com/en/globenewswire.com/6df6674bbaeba14da317878add1c3ee2","width":300,"height":88},"resize_sm":{"url":"https://s.yimg.com/ny/api/res/1.2/qKzaUj2j7AwfqYbXDYkXCQ--/YXBwaWQ9aGlnaGxhbmRlcjt3PTQyMDtoPTEyMztjZj13ZWJw/https://media.zenfs.com/en/globenewswire.com/6df6674bbaeba14da317878add1c3ee2","width":300,"height":88}},"lazy":false},{"type":"text","content":"Spotlighting end-to-end AI infrastructure portfolio for gigawatt-scale clusters – spanning XPU, Ethernet, Optics, SerDes, DSP, and PCIe solutions","length":150,"tagName":"p"},{"type":"text","content":"PALO ALTO, Calif., March 12, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the 2026 Optical Fiber Communications Conference and Exhibition (OFC) from March 15-19 in Los Angeles. Broadcom’s demonstrations and presentations will highlight its end-to-end connectivity solutions paving the path for the 200T AI era.","length":816,"tagName":"p"},{"type":"text","content":"“The explosion of generative AI demands an open, end-to-end fabric that can scale without compromise,” said Charlie Kawwas, Ph. D., president of Broadcom’s Semiconductor Solutions Group. “From the industry's first and only shipping 102T Ethernet switch to our first-to-market 400G/lane optical DSPs, we are out-innovating the market to solve the most complex power and bandwidth challenges with open standards for scale-up, scale-out, and scale-across connectivity. We are successfully executing on our roadmap to 200T, providing our partne...