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Broadcom Advances Optical Connectivity for AI Infrastructure with Industry-Leading Solutions at OFC 2025
Broadcom Advances Optical Connectivity for AI Infrastructure with Industry-Leading Solutions at OFC 2025
About this update from Broadcom Inc.
[{"type":"text","content":"Broadcom showcases optical interconnect solutions for next generation AI clusters; Highlights path to 200T\nPALO ALTO, Calif., March 31, 2025 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the expansion of its portfolio of optical interconnect solutions to enable AI infrastructure. These innovative technologies, including advancements in co-packaged optics (CPO), 200G/lane DSP and SerDes, 400G optics, and PCIe Gen6 over optics, will be showcased at the 2025 Optical Fiber Communications Conference and Exhibition (OFC). Broadcom’s demonstrations highlight the company’s roadmap towards 200T optical interconnect solutions. AI workloads are rapidly increasing, driving the need for higher bandwidth, lower latency, and more power-efficient optical interconnects. Broadcom is meeting these evolving demands with a comprehensive portfolio of innovative solutions designed to support the growth and scalability of AI clusters. These solutions include low-power, high-bandwidth DSP, SerDes and CPO for reduced power consumption and improved signal integrity, and PCIe Gen6 over optics for enhanced connectivity between AI accelerators and other system components. At OFC, Broadcom is showcasing a wide range of novel technologies underscoring our commitment to developing cutting-edge solutions for AI infrastructure: XPU-CPO: Industry’s first 6.4-Tbps optics attach for custom AI accelerator (XPU) enabling high bandwidth, long reach scale-up fabric connectivity for AI servers.Sian3: State-of-the-art 3nm 200G/lane DSP delivering industry’s lowest power consumption with enhanced performance for 800G and 1.6T optical transceivers over SMF.Sian2M: Industry’s first 200G/lane DSP with integrated VCSEL drivers enabling low power, short reach MMF links in AI clusters.200G/lane Lasers: Leading-edge 200G VCSEL, EML and CWL technologies facilitating high speed interconnects for front-end and back-end networks of large-scale AI clusters.400G EML: Industry’s first demonstration of 400G EML technology for next-generation AI optical interconnects.PCIe Gen6 over Optics: Industry’s first demonstration of PCIe Gen6 optical connectivity for AI scale-up fabric using Broadcom’s market-proven 100G VCSEL and photodetector.LPO / BCM957608 NIC: Industry-leading 400G PCIe Ethernet NIC connecting with LPO module to enable scalable AI networks with high perform...