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AXCELIS ANNOUNCES PARTICIPATION IN SEMICON JAPAN 2023
Showcase Features the Purion and GSD Ovation Series of Ion Implanters Designed to Deliver Significant Technology and Manufacturing Advantages BEVERLY, Mass.,
About this update from Axcelis Technologies, Inc.
[{"type":"text","content":"Showcase Features the Purion and GSD Ovation Series of Ion Implanters Designed to Deliver Significant Technology and Manufacturing Advantages\nBEVERLY, Mass., Dec. 5, 2023 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it will showcase its Purion™ and GSD Ovation™ Series of ion implanters at the SEMICON Japan 2023 exhibition. The conference and exhibition is being held December 13-15, at the Tokyo Big Sight in Tokyo, Japan. Axcelis will be located in East Hall 5, Booth #5821.\n\n \n \n \n \n \n \n\n \nSemiconductor manufacturers are invited to visit the Axcelis exhibit to learn first-hand about innovative ion implant solutions that deliver significant technology and manufacturing advantages.\nPurion Power Series™ - Featuring Axcelis' innovative solution for thin silicon, TAIKO and silicon carbide (SiC) wafer processing across the full power device applications space.Purion H™ Series - Including the new Purion H5™ and the Purion Dragon™, both designed to provide a comprehensive solution for high current implants.Purion H200™ - Axcelis' state of the art single wafer high current medium energy implanter designed to address the unique implant needs for devices designed for the Internet of Things (IoT) and power applications.Purion XE™ Series - Including the new Purion XEmax™, is the industry leading high energy implant platform, featuring patented Boost Technology™, designed for the most advanced image sensor applications up to 15MeV.Purion M™ Series - Offering the broadest spectrum of mid-current doses available, enabling unparalleled flexibility to meet today's evolving implant requirements. GSD Ovation™ - Providing the most cost-effective way to extend high current and high energy batch platform capability by supporting emerging applications in wafer splitting (Si and SiC) and alternate substrates (lithium tantalate and ceramic). During the show, Axcelis will also host the following events on Thursday, Dec. 14th:\nSiC Power Device Manufacturing Ion Implant TechnologyExhibitor's TechSPOT Hall 5, 15:30 - 15:50 p.m.The power device market is at a critical inflection point as chipmakers transition from 150mm to 200mm SiC wafers. Ion implant equipment needs to offer the flexibility to handle multiple wafer sizes, ...