Press release
Applied Materials Introduces New Sym3® Etch System for Advanced Memory and Logic Chips
Sym3® Y tailored to critical conductor etch applications in 3D NAND, DRAM and foundry-logic nodesNewest offering broadens adoption of the fastest-ramping
About this update from Applied Materials, Inc.
[{"type":"text","content":"Sym3® Y tailored to critical conductor etch applications in 3D NAND, DRAM and foundry-logic nodesNewest offering broadens adoption of the fastest-ramping product in company historyMilestone reached: 5,000th Sym3 chamber has now shipped SANTA CLARA, Calif., Aug. 07, 2020 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced a new addition to its highly successful Centris® Sym3® etch product family that now enables chipmakers to precisely pattern and shape ever-smaller features in leading-edge memory and logic chips.\n\n \n \n \n \n \n \n \n \n \n \n \n The Applied Materials Centris® Sym3® Y etch system enables chipmakers to precisely pattern and shape ever-smaller features in leading-edge memory and logic chips.\n \n \n \n \n \n \n \n \n\n The new Centris Sym3® Y is Applied’s most advanced conductor etch system. It uses innovative RF pulsing technology to provide the extremely high materials selectivity, depth control and profile control needed by customers to create densely packed, high-aspect-ratio structures in 3D NAND, DRAM and logic, including FinFETs and emerging gate-all-around architectures. A unique technical feature of the Sym3 family is a high-conductance chamber architecture that provides exceptional etch profile control by quickly and efficiently exhausting the etch byproducts that can accumulate with each wafer pass. The Sym3 Y system extends the benefits of this successful architecture with a proprietary new coating material that protects critical chamber components, thereby further reducing defects and enhancing yields. First introduced in 2015, the Sym3 etch system has become Applied’s fastest ramping product in company history, and the company has just shipped the 5,000th chamber. The Sym3 family is key to Applied’s strategy of giving customers new ways to shape and pattern materials, enabling novel 3D structures and new ways to continue 2D shrinking. Applied is co-optimizing the Sym3 system with unique CVD patterning films, enabling customers to increase the layers in 3D NAND memory devices and reduce the number of steps needed in the quadruple patterning of DRAM layers. These are being deployed along with Applied’s e-beam inspection and review technologies to accelerate R&D and high-volume ramps of the industry’s most advanced nodes, helping customers improve chip power, performance, area-cost and time t...