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Amkor Advanced Packaging Enables the Car of the Future
TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services and the #1 automotive
About this update from Amkor Technology, Inc.
[{"type":"text","content":" TEMPE, Ariz.--(BUSINESS WIRE)--\nAmkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to enable the car of the future.\n\n\nThe evolution of the enhanced automotive experience has been dramatic over the past few years—a rise evidenced in car-related semiconductor sales. In 2015, the auto semiconductor market was approximately $30B. Since then, it has more than doubled to $68B in 2022 and is expected to continue to grow over the next few years at a mid-teens compound annual growth rate—representing one of the highest growth segments in the semiconductor industry. This increase is driven by higher demand for autonomous functionality, digital control systems, and vehicle electrification. As the leading automotive OSAT with more than 40 years of automotive experience and a broad geographic footprint supporting global and enabling regional supply chains, Amkor is well positioned to capture growth from the acceleration of semiconductor content in cars.\n\n\nThe move toward advanced driver assistance systems (ADAS) and full autonomy—motivated by regional legislation and consumer preference—has led automotive manufacturers to install enhanced safety and convenience features as standard in base models. Advanced packaging solutions include ADAS to automate aspects of the driving process like parking assistance, lane positioning and collision avoidance. ADAS technologies use multiple sensors such as radar, LIDAR, ultrasonic, and image sensors to improve the safety of the vehicle. While wirebond continues to be the dominant interconnect for automotive packages, ADAS modules are increasingly using advanced interconnect technologies such as flip chip BGA, wafer level fan-out, and flip chip CSP. Advanced silicon nodes are growing quickly for ADAS processors with 7 nm already in production at Amkor and 5 nm solutions expected to be quickly adopted in automotive applications.\n\n\nBehind the wheel, consumers want an immersive and interactive in-car experience that is both entertaining and informative. To meet demand for this digital control center, Amkor continues to develop advanced infotainment and telematics package solutions that offer seamless connectivity, intuitive interfaces, and personalized experiences. These solutions includ...