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Aehr Test Systems and ISE Labs Announce Partnership on Wafer-Level Test and Burn-in for High-Performance Computing and Artificial Intelligence Processors

FREMONT, CA / ACCESS Newswire / November 3, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today

articleAehr Test SystemsNovember 3, 20255/company/aehr-test-systems/news/aehr-test-systems-and-ise-labs-announce-partnership-wafer-level-test-and-burn-high
Aehr Test Systems and ISE Labs Announce Partnership on Wafer-Level Test and Burn-in for High-Performance Computing and Artificial Intelligence Processors

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[{"type":"text","content":"FREMONT, CA / ACCESS Newswire / November 3, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced a strategic partnership with ISE Labs, Inc., a leading provider of semiconductor engineering services, to deliver advanced wafer-level test and burn-in services tailored for high-performance computing (HPC) and artificial intelligence (AI) applications. ISE Labs is a subsidiary of ASE, Inc., the world's leading provider of outsourced semiconductor assembly and test (OSAT) services.Through this partnership, Aehr and ISE Labs will deliver advanced wafer-level test and burn-in services designed for next-generation HPC and AI applications.Aehr and ISE Labs share a long history of collaboration and innovation, including the first installed base of Aehr's Sonoma high-power packaged part test systems. ISE Labs was also the first lab to purchase Aehr's FOX-NP™ system for wafer-level burn-in of silicon photonics devices, underscoring the companies' shared commitment to advancing semiconductor test technology.Strategically located in Silicon Valley, ISE Labs is uniquely positioned to accelerate the development and deployment of cutting-edge solutions for HPC and AI, supporting the surging demand for advanced heterogeneous integration and optical interconnect technologies.As demand for chip-on-wafer-on-substrate (CoWoS) technology continues to rise, the ability to deliver known good die (KGD) has become critical for maximizing device yields and controlling costs. Detecting latent issues early in production saves significant time and resources compared to identifying them only at the final packaging stage. Production burn-in remains essential for ensuring HPC device performance and long-term reliability.Gayn Erickson, President and CEO of Aehr Test Systems, commented, \"Our collaboration with ISE represents a unique model in the industry. Aehr's technology leadership in wafer-level and package-level burn-in, combined with ISE's demonstrated capabilities in qualification and production test and burn-in of the world's leading AI processors, creates a complete turnkey solution for customers wanting to accelerate their time to market for their devices.\"Vijay Israni, Vice President, New Product Introduction at ISE Labs, stated, \"We are excited to announce this partnership with Aeh...

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