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Aehr Receives Order for FOX-XP™ System for Production Wafer Level Burn-in of Next Generation Silicon Photonics Integrated Circuits
FREMONT, Calif., May 09, 2023 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and production burn-in
About this update from Aehr Test Systems
[{"type":"text","content":"FREMONT, Calif., May 09, 2023 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and production burn-in equipment, today announced it has received the first order for a new high-power configuration of its FOX-XP™ system for production wafer level burn-in of next generation silicon photonics integrated circuits (ICs) from a current major silicon photonics customer. This FOX-XP multi-wafer test and burn-in system is configured to enable cost-effective production test of the next generation of silicon photonics ICs, which can require up to two to four times as much power for full wafer test, burn-in, and stabilization of the silicon photonics devices. Shipment of this new higher-power configured FOX-XP is scheduled for the first quarter of 2024. Gayn Erickson, President and CEO of Aehr Test Systems, commented, “We are excited to receive this first order for this system configuration from one of the world’s largest semiconductor manufacturers and expect them to order additional production systems as they ramp capacity for these devices. This new FOX production system configuration expands the market opportunities of the FOX-XP system, as it’s able to test, burn-in, and stabilize up to nine 300mm wafers in parallel with up to 3.5 kW of power per wafer, which is beyond the wafer parallelism and power capacity of any system on the market. The system is also configured to allow direct docking to Aehr’s new fully automated FOX WaferPak Aligner and material handling system. “Multiple major semiconductor suppliers and foundries have announced their plans to manufacture and integrate silicon photonics into multi-chip packages, often now referred to as co-packaged devices or heterogenous integration, such as high-performance microprocessors, graphics processors, and processor to peripheral device chipsets. These new devices have been predicted to dramatically improve the communication bandwidth between semiconductor devices beyond the bottle neck of traditional electrical interfaces used today. The challenge is that the devices individually can require a long production burn-in to weed out early failures or long stress tests to stabilize them before they can be assembled in the package with the other devices. This drives the need for high volume, low cost, burn-in of these devices in wafer form, ...