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Aehr Announces At-The-Market (ATM) Offering of Common Stock
FREMONT, Calif., Feb. 07, 2023 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR) (the “Company”), a worldwide supplier of semiconductor test and
About this update from Aehr Test Systems
[{"type":"text","content":"FREMONT, Calif., Feb. 07, 2023 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR) (the “Company”), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has entered into a sales agreement with William Blair & Company, L.L.C. and Craig-Hallum Capital Group LLC in connection with the offer and sale of up to $25 million of shares of the Company’s common stock. The shares will be sold on the open market via an At-The-Market (ATM) offering pursuant to an effective shelf registration on Form S-3 filed with the Securities and Exchange Commission (the “SEC”) on September 3, 2021. The Company’s common stock is listed on the Nasdaq Capital Market under the symbol “AEHR.” The Company plans to use the net proceeds, if any, of sales of its common stock issued under the ATM offering for general corporate purposes, which may include, among other things, increasing its working capital and inventory, funding research and development, commercial activities, and capital expenditures. About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in semiconductor devices in wafer level, singulated die, and package part form, and has installed over 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge silicon carbide-based power semiconductors, memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The FOX-CP system is a new low-cost singl...