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Samsung and AMD Expand Strategic Collaboration on Next-Generation AI Memory Solutions
The companies will collaborate on industry-leading HBM4 supply for AMD Instinct™ MI455X GPUs and next-generation DDR5 solutions for AMD EPYC™ processors and
About this update from Advanced Micro Devices Inc
[{"type":"text","content":"\nThe companies will collaborate on industry-leading HBM4 supply for AMD Instinct™ MI455X GPUs and next-generation DDR5 solutions for AMD EPYC™ processors and the AMD Helios platform\n\n\n SEOUL, South Korea & SANTA CLARA, Calif.--(BUSINESS WIRE)--\nSamsung Electronics Co., Ltd. today announced it has signed a Memorandum of Understanding (MOU) with AMD to expand their strategic collaboration on next-generation AI memory and computing technologies.\n\n\nThe signing ceremony was held at Samsung’s most advanced chip manufacturing complex in Pyeongtaek, Korea, attended by Dr. Lisa Su, Chair and CEO of AMD, and Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics.\n\n\n“Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration,” said Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics. “From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD’s evolving AI roadmap.”\n\n\n“Powering the next generation of AI infrastructure requires deep collaboration across the industry,” said Dr. Lisa Su, Chair and CEO of AMD. “We are thrilled to expand our work with Samsung, bringing together their leadership in advanced memory with our Instinct GPUs, EPYC CPUs and rack-scale platforms. Integration across the full computing stack, from silicon to system to rack, is essential to accelerating AI innovation that translates into real-world impact at scale.”\n\n\nUnder the MOU, Samsung and AMD will align on primary HBM4 supply for the next-generation AMD AI accelerator, the AMD Instinct MI455X GPU, as well as advanced DRAM solutions for 6th Gen AMD EPYC CPUs, codenamed “Venice.” These technologies will support next-generation AI systems combining AMD Instinct GPUs, AMD EPYC CPUs and rack-scale architectures such as the AMD Helios platform.\n\n\nSamsung and AMD are closely collaborating on advanced memory technologies for AI and data center workloads. As memory bandwidth and power efficiency become increasingly critical to system-level performance, this collaboration will help deliver more optimized AI infrastructure for customers.\n\n\nAn industry-first to enter mass production, Samsung’s HBM4 is built on its most advanced 6th...