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ACM Research Expands Ultra C Family with Suite of Semi-Critical Cleaning Systems
Broadens ACM’s Product Portfolio to Deliver More Value to Customers FREMONT, Calif., May 06, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (NASDAQ: ACMR), a
About this update from Acm Research, Inc.
[{"type":"text","content":"Broadens ACM’s Product Portfolio to Deliver More Value to Customers\nFREMONT, Calif., May 06, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer-processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced its offering of a suite of three Ultra C wet cleaning tools for front- and backside processes. These semi-critical cleaning tools--the Ultra C b for backside clean, Ultra C wb automated wet bench, and Ultra C s scrubber--extend ACM’s innovative wet-processing technology into broader applications.\n “Our China-based customers have requested that we provide additional tools beyond the leading-edge ACM products that have been deployed for the most critical process steps. We have responded with so-called ‘semi-critical tools,’ which offer high-quality processing to support additional, less demanding but still important steps in their production chain,” noted David Wang, Chief Executive Officer and President of ACM. “We developed the Ultra C suite to meet this demand with an expanded portfolio, helping move ACM toward becoming a one-stop shop that can serve our customers with a more competitive product offering.” The three new Ultra C tools target the advanced IC, power device, and advanced WLP markets. The Ultra C b and Ultra C wb tools have already begun to demonstrate their benefits in production environments at advanced semiconductor plants in China. The initial Ultra C s was delivered to a Chinese customer in the first quarter of 2020, with revenue recognition expected upon qualification and acceptance. Backside clean The Ultra C b is a cost-effective backside cleaning tool that provides good particle performance and etch uniformity control for three key applications: backside metal removal or RCA clean; backside silicon etching for wet wafer thinning or wet through-silicon via (TSV) reveal; and backside film removal on poly silicon, oxide and nitride layers for wafer recycling. With features that help mitigate high warpage, the system is especially well suited for processing 200mm or 300mm ultra-thin wafers and bonding wafers. Instead of a conventional wafer chuck, which can damage the front side of the wafer, the tool’s chuck implements the Bernoulli effect to float the wafer above the chuck without physical contact. Once the solvents are s...