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ACM Research Expands into Chemical Vapor Deposition Market to Support Logic & Memory Manufacturing
FREMONT, Calif., Dec. 12, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor
About this update from Acm Research, Inc.
[{"type":"text","content":"FREMONT, Calif., Dec. 12, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today, through its operating subsidiary ACM Research (Shanghai), Inc., announced the introduction of its Ultra PmaxTM Plasma-Enhanced Chemical Vapor Deposition (PECVD) tool, marking ACM’s entry into another major new product category. ACM expects to ship its first PECVD evaluation tool to a China-based customer in the next few weeks. “Our Ultra PmaxTM PECVD tool marks expansion into another new process area of front-end semiconductor manufacturing,” said Jian Wang, CEO of ACM Research (Shanghai), Inc. “Many of our customers are 28nm and above logic device providers. We anticipate a need to increase capacity at more mature nodes, as mature node production in China is significantly lower than consumption. The new PECVD tool provides ACM with another opportunity to better serve our customers while addressing the global logic and memory market. We estimate that our total addressable global market will double with the Ultra PmaxTM category announced today and the Ultra Track category announced last month.” About ULTRA PmaxTM PECVD ToolThe ULTRA PmaxTM PECVD tool is equipped with a proprietary designed chamber, gas distribution unit and chuck, which is intended to provide better film uniformity, reduced film stress, and improved particle performance. It is available in two configurations: a one to three-chamber design that is ideal for very thin layers or fast process steps, and a four to five-chamber design that supports thick film deposition and longer process times while still optimizing throughput. Both configurations have multiple heaters per chamber for greater process control and higher productivity. Forward-Looking Statements Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forward-looking statements include statements regarding ACM’s expected shipment timeline for its Ultra PmaxTM PECVD tool and ACM’s estimate of the resulting increase in its total addressable market from recent new product introductions. Forward-looking statements are based on ACM management’s current expectat...