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<title>Fit Hon Teng Limited — News on 6ix</title>
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<title>Lightmatter Announces Reference Architecture Initiative with Industry Leaders in the Open Compute Project for Co-Packaged Optics</title>
<link>https://6ix.com/company/foxconn-interconnect-tech-ltd/news/lightmatter-announces-reference-architecture-initiative-with-industry-leaders-in-the-open-compute-project-for-co-packaged-optics</link>
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<pubDate>Mon, 16 Mar 2026 13:00:00 GMT</pubDate>
<description>MOUNTAIN VIEW, Calif., March 16, 2026--Lightmatter, today announced a new collaborative initiative within the Open Compute Project (OCP) to create open specifications for a shared reference architecture enabling interoperable Co-Packaged Optics (CPO) in next-generation AI systems. The announcement, in conjunction with the submission of a white paper titled "Open Collaboration for CPO-Enabled AI Systems," will initiate the project. This proposal underscores Lightmatter’s commitment to advancing A</description>
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<title>FIT Hon Teng Showcases at Hon Hai Tech Day, Demonstrating the Foxconn's Vertical Integration Strength</title>
<link>https://6ix.com/company/foxconn-interconnect-tech-ltd/news/fit-hon-teng-showcases-at-hon-hai-tech-day-demonstrating-the-foxconns-vertical-integration-strength</link>
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<pubDate>Fri, 21 Nov 2025 04:05:00 GMT</pubDate>
<description>Hon Hai Tech Day will take place on November 21–22 at the Nangang Exhibition Center, spotlighting "The Real-World Applications of Hon Hai's Three Major Intelligent Platforms Combined with AI Technologies." The event will fully showcase the Group's latest advances in AI innovation.</description>
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<title>FIT Tech Day 2025: Bringing Together Global Industry Leaders and Technology Experts to Shape the Future of Smart Mobility</title>
<link>https://6ix.com/company/foxconn-interconnect-tech-ltd/news/fit-tech-day-2025-bringing-together-global-industry-leaders-and-technology-experts-to-shape-the-future-of-smart-mobility</link>
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<pubDate>Wed, 10 Sep 2025 08:08:00 GMT</pubDate>
<description>FIT Hon Teng (hereafter "FIT") will host the inaugural FIT Tech Day 2025 on September 17 at Syntrend Creative Park, 5th floor, in Taipei. This landmark event will bring together industry leaders, technical experts, and academic representatives to explore the future of smart mobility and automotive solutions.</description>
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<title>Point2 Technology and Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect</title>
<link>https://6ix.com/company/foxconn-interconnect-tech-ltd/news/point2-technology-and-foxconn-interconnect-technology-partner-to-revolutionize-ai-cluster-scalability-with-terabit-speed-interconnect</link>
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<pubDate>Tue, 05 Aug 2025 15:00:00 GMT</pubDate>
<description>SAN JOSE, Calif., August 05, 2025--Point2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions. This collaboration breaks new ground in AI cluster scalability, ushering</description>
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