Development of DDS2030: Die Separator for Small Die Devices

Stealth Dicing™ is a dicing process where a modified layer is formed by focusing a laser beam inside the workpiece, following which stress is applied externally to separate it into die.
As typical semiconductors such as logic and memory devices have relatively larger die, they can be separated just by expanding the dicing tape.
On the other hand, for LED display devices, analog devices, or high frequency devices, the die size can be as small as 1 mm or lower, and separation was difficult using just tape expansion. In addition, the conventional breaking method where a plate-shaped tool is pressed against the workpiece and breaking is performed one line at a time had a high yield, but a low throughput.
DDS2030 uses a newly developed "roller breaking method," enabling separation of the abovementioned small die devices with a high throughput.

• Installed with a roller breaking mechanism optimal for singulating small die devices
• • Supports square die from 0.15 up to 0.5 mm in size
  
  
• High throughput
• • Achieves a UPH of 36
  • Note: The results may differ based on the wafer and processing conditions. This data is for reference under certain conditions only and are not guaranteed by DISCO. Does not include the throughput of SD.
  
  
• Installed with mechanisms that automatically perform mounting and peeling of a protective film for the device surface
• • All processes can be completed within one equipment