Taiwan Semiconductor Manufacturing Co., Ltd. · TWSE:2330
Hou Yung-Chin received 20,313 Taiwan Semiconductor Manufacturing Co., Ltd. shares as an award (Form 4)
Traded Sep 1, 2026 · Filed Sep 2, 2026
On Sep 1, 2026, Hou Yung-Chin (SVP and Deputy Co-COO) received 20,313 Taiwan Semiconductor Manufacturing Co., Ltd. shares as an award, leaving 682,716 shares. Filed Sep 2, 2026 (Form 4).
- Awarded
- 20,313 shares
- Holding after
- 682,716 shares
- Trading plan
- No
- Role
- SVP and Deputy Co-COO
The filing in full
| Date | Security | Transaction | Shares | Price | Holding after | Ownership |
|---|---|---|---|---|---|---|
| Sep 1, 2026 | Common Shares (2330.TW) | Award | 20,313 | 682,716 | Direct |
Source
Related
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hou Yung-Chin
- Taiwan Semiconductor Manufacturing Co., Ltd. shareholders
- Form 4 · Hou Yung-Chin · Oct 8, 2026
- Form 4 · Hou Yung-Chin · Sep 9, 2026
- Form 4 · Hou Yung-Chin · Aug 10, 2026
- Form 4 · Hou Yung-Chin · Jul 9, 2026
- Form 4 · Hou Yung-Chin · Jun 9, 2026
- Form 4 · Fang Shu-Hua · Oct 8, 2026
- Form 4 · Chen Chih-Ho · Oct 8, 2026
- Form 4 · Chang Tzonz-Sheng · Oct 8, 2026
- Form 4 · Lin Chris Horng-Dar · Oct 8, 2026
- Form 4 · Chuang Juiping · Oct 8, 2026